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PRODID:-//Microsoft Corporation//Outlook MIMEDIR//EN
VERSION:2.0
BEGIN:VEVENT
DTSTART:20151117T233000Z
DTEND:20151118T010000Z
LOCATION:18CD
DESCRIPTION;ENCODING=QUOTED-PRINTABLE:ABSTRACT: Today’s practice for liquid cooling is to use CDUs with constant flow-rate and temperature.  Tomorrow’s products could be designed for variable flow-rate and temperature based on actual heat removal requirements, but there would have to be more and finer grained telemetry and controls. How much savings can be gained in energy savings compared to the incremental capital and operational costs?   Application load differences can cause rack power variation, but nodes within a rack can also vary.  Where is the sweet spot for implementation- at the rack, node or even component level? This BoF will address these and other related questions.
SUMMARY:Dynamic Liquid Cooling, Telemetry and Controls: Opportunity for Improved TCO?
PRIORITY:3
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END:VCALENDAR