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PRODID:-//Microsoft Corporation//Outlook MIMEDIR//EN
VERSION:1.0
BEGIN:VEVENT
DTSTART:20151117T220000Z
DTEND:20151117T223000Z
LOCATION:12AB
DESCRIPTION;ENCODING=QUOTED-PRINTABLE:ABSTRACT: A high performance compute cluster constructed using high density modular subsystems is described in this paper. Distance between a large number of processing nodes are minimized by using 3-D packaging and complex flex circuit technologies. The base processing module (a leaf), contains local memory and power supply, is fabricated using Direct Chip Attach (DCA) technology onto a rigid-flex substrate.  A four processing node is formed by attaching four leafs to a node block (a circuit board with a centrally located connector) via flex circuits. The processing nodes are interconnected via a cluster board (motherboard). The leafs of each processing node are folded 90o with respect to the surface of the node block and  intimately contracting a liquid cooled thermal management unit for heat removal. Up to 64 processing nodes can be housed on a 22” x 19” motherboard. Minimum distance between processing nodes on the same motherboard is thus achieved.
SUMMARY:High Performance Compute Cluster Constructed with High Density Rigid-Flex Based Modules
PRIORITY:3
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