SCHEDULE: NOV 15-20, 2015

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Emerging Technology for Persistent Challenges in Optical Interconnects and Photonics Packaging

SESSION: Emerging Technologies Exhibits

EVENT TYPE: Emerging Technologies

EVENT TAG(S): SoC for HPC

TIME: 9:00AM - 5:30PM

SESSION CHAIR(S): Simon McIntosh-Smith, Sadaf R. Alam

ROOM:14

ABSTRACT:

Ultra-high precision forming is an emerging technology capable of manufacturing low volumes (thousands per year) and high volumes (hundreds of millions per year) of metallic components with sub-micrometer tolerances. It is enabling the next-generation of fiber-optic packaging and connectors for photonics in supercomputing and networks. Ultra-high precision forming relies on advances in material characterization, simulation and optimization methods used to design the forming process, the manufacture of hardened tools with sub-micrometer precision, and dimensional metrology. This exhibit highlights these technical advances and illustrates how they enable the forming of 1) meso-scale components with sub-micrometer tolerances, 2) micro-structured grooves that hold and accurately locate optical fibers, and 3) micro aspherical mirror arrays that focus and bend light from optical fibers into photonic integrated circuits, laser arrays, and detector arrays. These elements are integrated together into stamped components that simplify and reduce the cost of photonic packaging and single-mode fiber-optic cabling.

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