SCHEDULE: NOV 15-20, 2015

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High Performance Compute Cluster Constructed with High Density Rigid-Flex Based Modules

SESSION: Hardware and Architecture

EVENT TYPE: Exhibits, Exhibitor Forums

EVENT TAG(S): Hardware and Architecture

TIME: 4:00PM - 4:30PM

SESSION CHAIR(S): David Martin

Presenter(s):How Lin

ROOM:12AB

ABSTRACT:

A high performance compute cluster constructed using high density modular subsystems is described in this paper. Distance between a large number of processing nodes are minimized by using 3-D packaging and complex flex circuit technologies. The base processing module (a leaf), contains local memory and power supply, is fabricated using Direct Chip Attach (DCA) technology onto a rigid-flex substrate. A four processing node is formed by attaching four leafs to a node block (a circuit board with a centrally located connector) via flex circuits. The processing nodes are interconnected via a cluster board (motherboard). The leafs of each processing node are folded 90o with respect to the surface of the node block and intimately contracting a liquid cooled thermal management unit for heat removal. Up to 64 processing nodes can be housed on a 22” x 19” motherboard. Minimum distance between processing nodes on the same motherboard is thus achieved.

Chair/Presenter Details:

David Martin (Chair) - Argonne National Laboratory|

How Lin - i3 Electronics, Inc.

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